Isihlungi esinqunyiwe se-infrared siyisihlungi esibonakalayo esivumela ukukhanya okubonakalayo ukuthi kuhlungwe ukuze kususwe ukukhanya kwe-infrared. Sisetshenziswa kakhulu kumaselula, kumakhamera, ezimotweni, kuma-PC, kumakhompyutha ethebhulethi, ekuqapheni ukuphepha nakwezinye izinhlelo zokusebenza zekhamera yezithombe. Ngokuthuthuka okusheshayo kwama-electronics abathengi, izihlungi ezinqunyiwe ze-infrared sezibe yindlela enkulu kunazo zonke embonini yezihlungi.
Eminyakeni yamuva nje, izindawo eziyinhloko zokusungula imikhiqizo ngabakhiqizi befoni ephathekayo yimishini yamakhamera, izikrini, ukushaja okungenantambo kanye neminye imikhakha, kanti ukusebenza emkhakheni wamakhamera ukwanda kwenani lamakhamera, kusukela ekuqaleni kwekhamera eyodwa kuya kumakhamera amane, amakhamera amahlanu. Amakhamera, amakhamera ezimoto kusukela ekuqaleni kwamakhamera amabili kuya kwamanje angaphezu kweshumi, ukwanda kwenani lamakhamera kuya esidingweni semakethe yesihlungi esinqunyiwe se-infrared kulethe indima enkulu ekukhuthazeni.
Ukwanda kwesidingo semakethe sezihlungi ezinqunyiwe ze-infrared kuye kwavumela abakhiqizi bokucubungula imishini ukuthi babambe umoya. Ukusetshenziswa kwesihlungi kuncane, izidingo zemishini yokucubungula ziphezulu, futhi umsebenzi wokusika we-laser we-picosecond oluhlaza ungahlangabezana nezidingo zokucubungula zesihlungi esinqunyiwe se-infrared. Ububanzi bokukhanya okuluhlaza obungu-532nm, ukukhanya okubonakalayo, kungahlungwa ngesendlalelo sokumboza, ukusetshenziswa kwelensi noma ucingo oluqondile, kungagxilwa kungqimba yengilazi, kubhubhise ukucindezeleka kwangaphakathi kwengilazi, ukuze kufezwe injongo yokusika.
Ekucubungulweni kwesihlungi esinqunyiwe se-infrared,umshini wokusika nge-laserinendima ebalulekile,umshini wokusika nge-laserizinzuzo:
1, ukucutshungulwa okungenakho ukuthintana: ukucutshungulwa kwe-laser kuphela ngomqamelo we-laser kanye nokuxhumana kwe-workpiece, akukho mandla okusika izingxenye zokusika, ukugwema ukulimala ebusweni bezinto ezicutshunguliwe.
2, ukunemba okuphezulu kokucubungula, umphumela ophansi wokushisa: i-laser evunguzayo ingafinyelela amandla aphezulu asheshayo, ukuminyana kwamandla aphezulu kanye namandla aphansi ajwayelekile, ingaqedwa ngokushesha futhi indawo ethintekile ukushisa incane kakhulu, ukuqinisekisa ukucutshungulwa okunembile okuphezulu, indawo encane ethintekile ukushisa.
3, ukusebenza kahle kokucubungula okuphezulu, izinzuzo ezinhle zezomnotho: ukusebenza kahle kokucubungula nge-laser kuvame ukuba nomphumela wokucubungula ngomshini izikhathi eziningana futhi akukho okudliwayo okungenakungcola. Ubuchwepheshe bokusika obungabonakali be-laser be-wafer ye-semiconductor buyinqubo entsha yokusika nge-laser, enezinzuzo eziningi ezifana nesivinini sokusika esisheshayo, akukho ukukhiqizwa kothuli, akukho ukulahleka kwe-substrate yokusika, indlela encane yokusika edingekayo, kanye nenqubo ephelele eyomile.
4, ngokuya ngesimo sesampula esiyindilinga, sebenzisa ikhanda lokusika ukusika imigqa emi-4 eqondile ezungeze isampula ngayinye eyindilinga yezingxenye ezisizayo. Uma ugxila ku-bessel beam, isihlungi sinqunywa ngesikhala esithile sendawo, futhi imifantu ingakhiwa phakathi kwamaphuzu. Ekugcineni, imifantu esakaza ifilimu yenziwa ukuze kuqedwe ukusika kwesihlungi. Ukuphuka komphetho wesihlungi esinqunyiwe ngale ndlela yokusika kuncane, okuthuthukisa ngempumelelo isivuno sesihlungi sokusika futhi kuthuthukise ukusebenza kahle kokusika.
Umshini wokusika nge-laserokwamanje iyithuluzi lokusika elingcono kakhulu, njengoba izidingo zemishini ezimbonini ezahlukahlukene ziyanda, kodwa futhi zithintwa yizimboni ezahlukahlukene, isidingo siyaqhubeka nokukhula.
Isikhathi sokuthunyelwe: Okthoba-21-2024
