Umthelela wesidingo semakethe sezihlungi ze-optical kumishini yokusika i-laser

I-infrared cut-off filter iyisihlungi esibonakalayo esivumela ukukhanya okubonakalayo ukuthi kuhlungwe ukuze kukhishwe ukukhanya kwe-infrared. Isetshenziswa kakhulu kumaselula, amakhamera, imoto, i-PC, amakhompyutha wethebulethi, ukuqapha ukuphepha kanye nezinye izinhlelo zokusebenza zezingxenye zekhamera ezibonisayo. Ngokuthuthuka okusheshayo kwama-elekthronikhi omthengi, izihlungi ezinqamule nge-infrared seziphenduke ithrekhi enkulu engaphansi embonini yokuhlunga.
Eminyakeni yamuva, izindawo eziyinhloko zokwenziwa komkhiqizo ngabakhiqizi befoni ephathekayo ziyimishini yekhamera, izikrini, ukushaja okungenantambo nezinye izinkambu, futhi ukusebenza emkhakheni wamakhamera ukwanda kwenani lamakhamera, kusukela ekuqaleni kwekhamera eyodwa kuya kumakhamera amane, amakhamera amahlanu. Amakhamera, amakhamera ezimoto kusukela ekuqaleni kwamabili kuya manje angaphezu kweshumi, ukwanda kwenani lamakhamera esidingweni semakethe yokuhlunga ye-infrared cut-off kulethe indima enkulu ekukhuthazeni.

Ukwenyuka kwesidingo semakethe sezihlungi ze-infrared cut-off nakho kuvumele abakhiqizi abalungisa imishini ukuthi bathathe umoya. Ukusetshenziswa kwesihlungi kuncane, izidingo zemishini yokucubungula ziphezulu, futhi umsebenzi wokusika we-laser picosecond oluhlaza ungahlangabezana nezidingo zokucubungula zesihlungi esisikiwe se-infrared. Ubude be-wavelength bokukhanya obuhlaza obungu-532nm, ukukhanya okubonakalayo, kungahlungwa ngesendlalelo sokumboza, ukusetshenziswa kwelensi yenhloso noma ucingo, kungagxilwa kungqimba lwengilazi, kubhubhise ukucindezeleka kwangaphakathi kwengilazi, ukuze kufezeke injongo yokusika.

Ekucutshungulweni kwesihlungi esinqunyiwe se-infrared,umshini wokusika we-laserinendima ebalulekile,umshini wokusika we-laserizinzuzo:
I-1, ukucutshungulwa okungekona othintana naye: ukucubungula i-laser kuphela ugongolo lwe-laser kanye nokuxhumana kwe-workpiece, akukho mandla okusika izingxenye zokusika, ukugwema ukulimala ebusweni bezinto ezicutshunguliwe.
I-2, ukunemba okuphezulu kokucubungula, umphumela oshisayo ophansi: i-laser pulsed ingafinyelela amandla aphezulu asheshayo, amandla aphezulu aphezulu namandla aphakathi nendawo, ingaqedwa ngokushesha futhi indawo ethintekile yokushisa incane kakhulu, ukuqinisekisa ukucubungula okuphezulu, indawo encane ethintekile ukushisa.
I-3, ukusebenza kahle okuphezulu kokucubungula, izinzuzo ezinhle zezomnotho: ukusebenza kahle kwe-laser ngokuvamile kuvame izikhathi eziningana umphumela wokucubungula ngomshini futhi akukho okudlekayo okungangcoliswa. Ubuchwepheshe bokusika obungabonakali be-laser be-semiconductor wafer iyinqubo entsha yokusika i-laser, enezinzuzo eziningi ezifana nesivinini sokusika ngokushesha, akukho sizukulwane sothuli, akukho ukulahlekelwa kwe-substrate yokusika, indlela encane yokusika edingekayo, kanye nenqubo eyomile ephelele.
I-4, ngokwesimo sesampula esiyindilinga, sebenzisa ikhanda lokusika ukuze usike imigqa eqondile engu-4 ezungeze isampula ngayinye eyindilinga ukuze uthole izingxenye ezisizayo. Ngokugxila ku-bessel beam, isihlungi sisikwa endaweni ethile, futhi kungakheka imifantu phakathi kwamaphoyinti. Ekugcineni, ifilimu esakaza imifantu yenziwa ukuze kuqedelwe ukusika kwesihlungi. Ukuphulwa konqenqemeni lwesihlungi esinqunywe ngale ndlela yokusika kuncane, okuthuthukisa ngokuphumelelayo isivuno sesihlungi sokusika futhi sithuthukise ukusebenza kahle kokusika.
Umshini wokusika i-laserokwamanje iyithuluzi elingcono kakhulu lokusika, elinezidingo ezikhulayo zemishini ezimbonini ezihlukahlukene, kodwa futhi ezithintekayo yizimboni ezihlukahlukene, isidingo siyaqhubeka sikhuphuka.