Ka kholo ea butle-butle ea li-laser le ho eketseha ha botsitso ba lisebelisoa tsa laser, ts'ebeliso ea lisebelisoa tsa laser e ntse e tsebahala haholoanyane, 'me lisebelisoa tsa laser li ntse li tsoela pele ho ea tšimong e pharaletseng. Tse kang laser wafer cutting, laser ceramic cutting, laser glass cutting, laser circuit board cutting, medical chip cutting joalo-joalo.
Mochini oa ho itšeha oa laser o na le melemo e latelang:
1. Boleng bo botle: laser e sebelisa theknoloji e tsoetseng pele, e nang le boleng bo botle ba boriti, sebaka se senyenyane sa ho tsepamisa maikutlo, ho fana ka matla a tšoanang, phello e nyenyane ea mocheso, bophara bo fokolang, melemo ea boleng bo phahameng;
2. Ho nepahala ho phahameng: ka galvanometer e nepahetseng le sethaleng, ho laola ho nepahala ka tatellano ea li-microns;
3. Ha ho na tšilafalo: laser cutting thekenoloji, ha ho lik'hemik'hale, ha ho na tšilafalo ho tikoloho, ha ho kotsi ho opareitara, tshireletso ya tikoloho le polokeho;
4. Lebelo le potlakileng: ka ho toba laela litšoantšo tsa CAD li ka sebetsoa, ha ho hlokahale hore li etse hlobo, li boloke litšenyehelo tsa tlhahiso ea hlobo le nako, potlakisa lebelo la nts'etsopele;
5. Theko e tlaase: ha ho na lisebelisoa tse ling tse sebelisoang ts'ebetsong ea tlhahiso, fokotsa litšenyehelo tsa tlhahiso.
Nako ea poso: Jul-01-2024
