Impembelelo yemfuno yemarike yeefilitha ze-optical kumatshini wokusika i-laser

I-infrared cut-off filter sisihluzo esibonakalayo esivumela ukukhanya okubonakalayo kuhluzwe ukuze kususwe ukukhanya kwe-infrared. Isetyenziswa kakhulu kwiifowuni eziphathwayo, iikhamera, imoto, iPC, iikhompyuter zethebhulethi, ukubekwa esweni kokhuseleko kunye nezinye iikhamera zokujonga izinto eziphambili zekhamera. Ngophuhliso olukhawulezayo lwezixhobo ze-elektroniki zabathengi, izihluzi ezisikiweyo ze-infrared ziye zaba yeyona ndlela inkulu engaphantsi kushishino lokucoca.
Kwiminyaka yakutshanje, iindawo eziphambili zokuveliswa kwemveliso ngabavelisi beefowuni eziphathwayo zizixhobo zekhamera, izikrini, ukutshaja ngaphandle kwamacingo kunye nezinye iindawo, kunye nokusebenza kwintsimi yeekhamera kukunyuka kwenani leekhamera, ukususela ekuqaleni kwekhamera enye ukuya kwiikhamera ezine, iikhamera ezintlanu. Iikhamera, iikhamera zeemoto ukusuka ekuqaleni kwesibini ukuya ngoku ngaphezu kweshumi, ukwanda kwenani leekhamera kwimfuno ye-infrared cut-off filter market kuzise indima enkulu ekukhuthazeni.

Ukonyuka kwemfuno yentengiso yezihluzo ezisikiweyo ze-infrared zikwavumele abavelisi bokulungisa izixhobo ukuba bathathe umoya. Ukusetyenziswa kwesihluzi kuncinci, iimfuno zezixhobo zokusebenza ziphezulu, kwaye umsebenzi wokusika we-picosecond laser ohlaza unokuhlangabezana neemfuno zokucutshungulwa kwe-infrared cut-off filter. Ukukhanya okuluhlaza okuluhlaza kwe-532nm, ukukhanya okubonakalayo, kunokucocwa ngomgca wokugquma, ukusetyenziswa kwe-lens yenjongo okanye ucingo, kunokugxininiswa kuluhlu lweglasi, ukutshabalalisa uxinzelelo lwangaphakathi lweglasi, ukuze kufezekiswe injongo yokusika.

Kwi-infrared cut-off filter process,umatshini wokusika we-laserinendima ebalulekileyo,umatshini wokusika we-laseruncedo:
I-1, i-non-contact processing: i-laser processing kuphela i-laser beam kunye ne-workpiece contact, akukho mandla okusika kwiindawo zokusika, ukuphepha umonakalo kumphezulu wezinto ezicutshungulwayo.
I-2, ukuchaneka okuphezulu kokusebenza, umphumo ophantsi we-thermal: i-laser ye-pulsed inokufikelela kumandla aphezulu ngokukhawuleza, ubuninzi bamandla aphezulu kunye namandla aphantsi aphakathi, inokugqitywa ngokukhawuleza kwaye indawo echaphazelekayo yokushisa incinci kakhulu, ukuqinisekisa ukucwangciswa okuphezulu ngokuchanekileyo, indawo encinci echaphazelekayo yokushisa.
I-3, ukusebenza kakuhle kokusetyenzwa okuphezulu, izibonelelo ezilungileyo zoqoqosho: ukusebenza kakuhle kwe-laser kumaxesha amaninzi isiphumo sokusebenza koomatshini kwaye akukho ngcoliseko-free. Itekhnoloji yokusika engabonakaliyo yeLaser ye-semiconductor wafer yinkqubo entsha yokusika i-laser, eneenzuzo ezininzi ezifana nesantya sokusika ngokukhawuleza, akukho sizukulwana sothuli, akukho lahleko yokusika i-substrate, indlela encinci yokusika efunekayo, kunye nenkqubo eyomileyo epheleleyo.
I-4, ngokwesikhundla sesampulu setyhula, sebenzisa intloko yokusika ukusika imigca emi-4 eqondileyo malunga nesampulu nganye yeesetyhula kumacandelo ancedisayo. Ukugxininisa kwi-bessel beam, isihluzo sinqunywe kwindawo ethile, kwaye ukuqhekeka kunokwakheka phakathi kwamanqaku. Ekugqibeleni, ifilimu isasaza iintanda ziqhutyelwa ukugqiba ukusika isihlunu. Ukuqhawulwa komda wesihlunu esinqunywe yile ndlela yokusika incinci, ephucula ngokufanelekileyo isivuno sokucoca kunye nokuphucula ukusebenza kakuhle.
Umatshini wokusika weLaserokwangoku sesona sixhobo sokusika, kunye neemfuno ezikhulayo zezixhobo kumashishini ahlukeneyo, kodwa zikwachatshazelwa ngamashishini ahlukeneyo, imfuno iyaqhubeka nokunyuka.