Isihluzo esinqumliweyo se-infrared sisihluzo esibonakalayo esivumela ukukhanya okubonakalayo ukuba kuhluzwe ukuze kususwe ukukhanya kwe-infrared. Sisetyenziswa kakhulu kwiifowuni eziphathwayo, iikhamera, iimoto, iikhompyuter, iithebhulethi, ukujonga ukhuseleko kunye nezinye izixhobo zekhamera yomfanekiso. Ngophuhliso olukhawulezileyo lwezixhobo ze-elektroniki zabathengi, izihluzo ezinqumliweyo ze-infrared ziye zaba yindlela enkulu ephantsi kwishishini lezihluzo.
Kwiminyaka yakutshanje, iindawo eziphambili zokuvelisa iimveliso ngabavelisi beefowuni eziphathwayo zizixhobo zeekhamera, izikrini, ukutshaja ngaphandle kwentambo kunye nezinye iinkalo, kwaye ukusebenza kwicandelo leekhamera kukwanda kwenani leekhamera, ukususela ekuqaleni kwekhamera enye ukuya kwiikhamera ezine, iikhamera ezintlanu. Iikhamera, iikhamera zeemoto ukususela ekuqaleni kwezimbini ukuya kuthi ga ngoku zingaphezulu kweshumi, ukwanda kwenani leekhamera ukuya kwimfuno yemarike yesihluzo esinqunyiweyo se-infrared kuzise indima enkulu ekukhuthazeni.
Ukwanda kwemfuno yemarike yezihluzo ezinqunyulwayo ze-infrared kukwavumele abavelisi bokucubungula izixhobo ukuba bathathe umoya. Ukusetyenziswa kwesihluzo kuncinci, iimfuno zezixhobo zokucubungula ziphezulu, kwaye umsebenzi wokusika we-picosecond laser eluhlaza unokuhlangabezana neemfuno zokucubungula zesihluzo esinqunyulwayo se-infrared. Ububanzi bokukhanya okuluhlaza obuyi-532nm, ukukhanya okubonakalayo, bunokuhluzwa ngokusebenzisa umaleko wokugquma, ukusetyenziswa kwelensi okanye ucingo olujoliswe kuyo, kunokujoliswa kumaleko weglasi, kutshabalalise uxinzelelo lwangaphakathi lweglasi, ukuze kufezekiswe injongo yokusika.
Kwinkqubo yokucoca isihluzi esinqunyiweyo se-infrared,umatshini wokusika nge-laserinendima ebalulekileyo,umatshini wokusika nge-laseriingenelo:
1, ukucutshungulwa okungenaqhagamshelwano: ukucutshungulwa kwelaser kuphela yilaser beam kunye noqhagamshelwano lomsebenzi, akukho mandla okusika kwiindawo zokusika, ukuze kuthintelwe umonakalo kumphezulu wezinto ezicutshungulwayo.
2, ukuchaneka okuphezulu kokucubungula, isiphumo esiphantsi sobushushu: i-laser eshukumayo inokufikelela kumandla aphezulu ngoko nangoko, uxinano lwamandla aphezulu kunye namandla aphantsi aphakathi, ingagqitywa ngoko nangoko kwaye indawo echaphazelekileyo kubushushu incinci kakhulu, ukuqinisekisa ukucutshungulwa okuchanekileyo, indawo encinci echaphazelekileyo kubushushu.
3, ukusebenza kakuhle kokucubungula, iingenelo ezilungileyo kwezoqoqosho: ukusebenza kakuhle kokucubungula nge-laser kudla ngokuphindwe kaninzi kunempembelelo yokucubungula ngoomatshini kwaye akukho zinto zisetyenziswayo ezingenangcoliseko. Itekhnoloji yokusika engabonakaliyo ye-laser ye-wafer ye-semiconductor yinkqubo entsha yokusika nge-laser, enezibonelelo ezininzi ezifana nesantya sokusika esikhawulezayo, ukuveliswa kothuli, ukulahleka kwe-substrate yokusika, indlela encinci yokusika efunekayo, kunye nenkqubo epheleleyo yokomisa.
4, ngokwendawo yesampulu ejikelezayo, sebenzisa intloko yokusika ukusika imigca emi-4 ethe tye ejikeleze isampulu nganye ejikelezayo ukuze ufumane amacandelo ancedisayo. Ukugxila kwi-bessel beam, isihluzo sinqunyulwa kwindawo ethile, kwaye iintanda zinokwenziwa phakathi kwamanqaku. Okokugqibela, iintanda ezisasaza ifilimu zenziwa ukuze kugqitywe ukusika isihluzo. Ukwaphuka komphetho wesihluzo esinqunyiweyo ngale ndlela yokusika kuncinci, nto leyo ephucula ngempumelelo isivuno sesihluzo sokusika kwaye iphucule ukusebenza kakuhle kwesihluzo.
Umatshini wokusika nge-laserokwangoku sesona sixhobo silungileyo sokusika, njengoko iimfuno zezixhobo zisanda kuyanda kumashishini ahlukeneyo, kodwa zikwachaphazeleka namashishini ahlukeneyo, imfuno iyaqhubeka nokukhula.
Ixesha leposi: Oktobha-21-2024
