Umatshini wokusika i-Laser kukugxininisa i-laser ekhutshwe kwi-laser ibe yi-high-power density laser beam ngokusebenzisa inkqubo ye-optical path. Njengoko indawo ehambelanayo ye-boam kunye ne-workpiece ihamba, izinto eziphathekayo zinqunyulwa ukufezekisa injongo yokusika. Ukusika kweLaser kuneempawu zokuchaneka okuphezulu, ukusika okukhawulezayo, okungaphelelanga kwizithintelo zepateni yokusika, ukuseta ngokuzenzekelayo ukugcina imathiriyeli, ukusika okugudileyo, kunye neendleko eziphantsi zokusetyenzwa. Ngoko ke, zeziphi izicelo zeteknoloji yokusika umatshini we-laser kwishishini leglasi?
Iglasi isetyenziswa kakhulu kushishino lweemoto, ulwakhiwo, iimfuno zemihla ngemihla, ubugcisa, unyango, imichiza, i-electronics, izixhobo, ubunjineli benyukliya kunye nezinye iinkalo. Iipaneli ezinkulu zeglasi zisetyenziswa kwishishini leemoto okanye ishishini lokwakha; izicelo zamashishini ziquka ii-substrates zeglasi ezincinci njengeemicrons ezimbalwa zokucoca okanye i-laptop flat panel displays, ezisetyenziswa ngokubanzi. I-Glass ineempawu zokungafihli kunye namandla aphezulu, kwaye ayinakuphepheka ukuyinqumla ekusebenziseni ngokwenene.
Iglasi inophawu olubaluleke kakhulu, oko kukuthi, ukuqina kunye nokuqina, okuzisa ubunzima obukhulu ekusebenzeni. Iindlela zokusika zendabuko zivame ukubangela iqondo elithile lomonakalo kwiglasi, njengale; iintanda, inkunkuma edge, ezi ngxaki zingenakuphepheka, kwaye ziya kwandisa iindleko zokwenza iimveliso zeglasi. Phantsi kweemfuno zetekhnoloji yale mihla, iimfuno zomgangatho weemveliso zeglasi ziya zinyuka nangaphezulu, kwaye zichaneke ngakumbi kwaye zineenkcukacha zeziphumo zokusetyenzwa kufuneka zifezekiswe.
Ngophuhliso lwetekhnoloji yelaser, iilaser ziye zavela kwiglasi yokusika. Iilaser ezinamandla aphezulu aphezulu kunye noxinano lwamandla aphezulu zinokutshintsha iglasi ngoko nangoko. Ukusika ngokweemfuno zangempela kunokusika iimilo ezihlangabezana neemfuno. Ukusika kweLaser kuyakhawuleza, kuchanekile, kwaye akukho burrs ekusikeni kwaye akukhawulelwanga kukumila. I-Lasers ayiyo-contact process, kwaye ukusika akuthandeki ukudilika komphetho, iintanda, kunye nezinye iingxaki. Emva kokusika, akukho mfuneko yokugungxulwa, ukugaya, ukupolisha, kunye nezinye iindleko zokwenziwa kwesibini. Ngelixa ukunciphisa iindleko, kukwaphucula kakhulu izinga lesivuno kunye nokusebenza kakuhle. Ndiyakholelwa ukuba itekhnoloji yokusika i-laser iya kuba ngakumbi nangakumbi, kwaye uphuhliso lwetekhnoloji yokusika iglasi ye-laser iya kuba ngcono kwaye ibengcono.
Ixesha lokuposa: Jun-20-2024
