ʻO ka hopena o ka noi mākeke no nā kānana optical ma nā mīkini ʻoki laser

ʻO kahi kānana ʻokiʻoki infrared he kānana optical e hiki ai i ke kukui ʻike ke kānana ʻia e wehe i ke kukui infrared. Hoʻohana nui ʻia i nā kelepona paʻalima, nā kāmela, nā kaʻa, nā PC, nā kamepiula papa, ka nānā ʻana i ka palekana a me nā mea ʻē aʻe imaging camera core optical component applications. Me ka hoʻomohala wikiwiki ʻana o nā mea hoʻohana uila, ua lilo nā kānana ʻokiʻoki infrared i ke ala haʻahaʻa nui loa i ka ʻoihana kānana.
I nā makahiki i hala iho nei, ʻo nā wahi nui o ka hana hou ʻana o ka huahana e nā mea hana kelepona paʻa, ʻo nā lako kāmela, nā pale, ka hoʻopiʻi uila a me nā māla ʻē aʻe, a ʻo ka hana ma ke kahua o nā kāmela ka hoʻonui ʻana i ka nui o nā kāmela, mai ka hoʻomaka ʻana o kahi kāmela hoʻokahi a i ʻehā mau kāmela, ʻelima mau kāmela. ʻO nā kāmela, nā kaʻa kaʻa mai ka hoʻomaka ʻana o ʻelua a i kēia manawa ʻoi aku ma mua o ka ʻumi, ʻo ka hoʻonui ʻana i ka nui o nā kāmela i ke koi ʻana o ka mākeke kānana infrared i lawe mai i kahi kuleana nui i ka hoʻolaha ʻana.

ʻO ka piʻi ʻana o ka noi mākeke no nā kānana ʻokiʻoki infrared ua ʻae pū i nā mea hana hana hana e lawe i ka makani. He liʻiliʻi ka hoʻohana ʻana i ka kānana, ʻoi aku ka kiʻekiʻe o ka pono o nā mea hana, a hiki i ka ʻōmaʻomaʻo picosecond laser cutting function ke hoʻokō i nā pono hana o ka kānana ʻoki ʻoki infrared. ʻO ka nalu'ōmaʻomaʻo'ōmaʻomaʻo o 532nm,ʻikeʻia ke kukui, hiki ke kānanaʻia ma o ka uhi uhi, ka hoʻohanaʻana i ka lens a iʻole ka uea, hiki ke nānā aku i ka papa aniani, e hoʻopau i ke kaumaha o loko o ke aniani, i mea e hoʻokō ai i ke kumu o kaʻokiʻana.

I ka hana kānana ʻoki ʻoki ʻia infrared,mīkini ʻoki laserhe kuleana koʻikoʻi,mīkini ʻoki laserpono:
1, ka hana hoʻopili ʻole: ka hana ʻana i ka laser wale nō a me ka hoʻopili ʻana i ka mea hana, ʻaʻohe ikaika ʻoki no ka ʻoki ʻana i nā ʻāpana, e pale i ka pōʻino i ka ʻili o ka mea i hana ʻia.
2, kiʻekiʻe kaʻina hana pololei, haʻahaʻa thermal hopena: pulsed laser hiki ke hoʻokō kiʻekiʻe instantaneous mana, kiʻekiʻe ikehu a me ka haʻahaʻa haʻahaʻa haʻahaʻa mana, hiki ke hoʻopau koke a me ka wela wela wahi liʻiliʻi loa, e hōʻoia kiʻekiʻe precision hana, liʻiliʻi wela wela wahi.
3, ʻoi aku ka maikaʻi o ka hoʻoili ʻana, nā pōmaikaʻi waiwai maikaʻi: ʻo ka hoʻomaʻamaʻa ʻana i ka laser i nā manawa he nui i ka hopena mechanical processing a ʻaʻohe mea hoʻopau pollution-free. ʻO ka laser invisible cutting technology o semiconductor wafer kahi kaʻina ʻokiʻoki laser hou, a he nui nā pono e like me ka wikiwiki o ka ʻoki ʻana, ʻaʻohe hana lepo, ʻaʻohe poho o ka substrate, ke ala ʻoki liʻiliʻi e pono ai, a me ke kaʻina hana maloʻo.
4, e like me ke kūlana o ka hāpana pōʻai, e hoʻohana i ke poʻo ʻokiʻoki e ʻoki i nā laina pololei 4 a puni kēlā me kēia hāpana pōʻai no nā ʻāpana kōkua. Ke nānā aku nei i ka bessel beam, ua ʻoki ʻia ka kānana ma kahi kikoʻī, a hiki ke hana ʻia nā māwae ma waena o nā kiko. ʻO ka hope, lawe ʻia ke kiʻiʻoniʻoni e hoʻolaha ana i nā māwae e hoʻopau i ka ʻoki ʻana o ka kānana. ʻO ka haki ʻana o ka ʻoki ʻoki ʻia e kēia ʻano ʻokiʻoki he liʻiliʻi, e hoʻomaikaʻi maikaʻi i ka hua o ka kānana ʻoki a hoʻomaikaʻi i ka ʻoki ʻana.
Mīkini ʻoki laseri kēia manawa ka meaʻoki maikaʻi loa, me ka hoʻonuiʻana i nā koi no nā mea hana i nāʻoihana likeʻole, akā i hoʻopilikiaʻia e nāʻoihana likeʻole, e piʻi mau ana ka noi.