Zotsatira za kufunika kwa msika kwa zosefera za kuwala pa makina odulira laser

Sefa ya infrared cut-off ndi sefa yowunikira yomwe imalola kuti kuwala kowonekera kusefedwe kuchotsa kuwala kwa infrared. Amagwiritsidwa ntchito makamaka pama foni am'manja, makamera, galimoto, PC, makompyuta apakompyuta, kuwunika kwachitetezo ndi zida zina zofananira zamakamera apakati. Ndikukula mwachangu kwamagetsi ogula, zosefera zodulira ma infrared zakhala njanji yayikulu kwambiri pamakampani azosefera.
M'zaka zaposachedwapa, madera waukulu wa mankhwala luso ndi opanga mafoni ndi zipangizo kamera, zowonetsera, nawuza opanda zingwe ndi minda ina, ndi ntchito m'munda wa makamera ndi kuwonjezeka kwa chiwerengero cha makamera, kuyambira chiyambi cha kamera limodzi kuti makamera anayi, makamera asanu. Makamera, makamera agalimoto kuyambira koyambirira kwa awiri mpaka pano opitilira khumi, kuchuluka kwa makamera kupita kukufuna kwa msika wa infrared odulidwa kwabweretsa gawo lalikulu pakulimbikitsa.

Kuwonjezeka kwa kufunikira kwa msika kwa zosefera zodulira ma infrared kwalolanso opanga zida kuti atenge mphepo. Kugwiritsa ntchito fyuluta ndikochepa, zofunikira zopangira zida ndizokwera, ndipo ntchito yobiriwira ya picosecond laser imatha kukwaniritsa zosefera zosefera za infuraredi. Kuwala kobiriwira kwa kutalika kwa 532nm, kuwala kowoneka, kungasefedwe kupyolera mu ❖ kuyanika, kugwiritsa ntchito lens cholinga kapena waya, kungathe kuyang'ana mu galasi wosanjikiza, kuwononga kupsinjika kwa mkati mwa galasi, kuti akwaniritse cholinga chodula.

Mu infrared cut-off filter processing,laser kudula makinaali ndi gawo lofunikira,laser kudula makinaubwino:
1, osakhala kukhudzana processing: laser processing yekha laser mtengo ndi workpiece kukhudzana, palibe mphamvu kudula kwa mbali kudula, kupewa kuwononga pamwamba pa zinthu kukonzedwa.
2, high processing mwatsatanetsatane, otsika matenthedwe zotsatira: pulsed laser akhoza kukwaniritsa mkulu nthawi yomweyo mphamvu, mkulu kachulukidwe mphamvu ndi otsika pafupifupi mphamvu, akhoza anamaliza yomweyo ndi kutentha akhudzidwa dera laling'ono kwambiri, kuonetsetsa mkulu mwatsatanetsatane processing, kutentha pang'ono anakhudzidwa dera.
3, mkulu processing dzuwa, ubwino zachuma: laser processing dzuwa nthawi zambiri kangapo mawotchi processing kwenikweni ndipo palibe consumables kuipitsa-free. Ukadaulo wodulira wosawoneka wa laser wa semiconductor wafer ndi njira yatsopano yodulira laser, yomwe ili ndi zabwino zambiri monga kuthamanga mwachangu, palibe fumbi la fumbi, kutayika kwa gawo lapansi, njira yaying'ono yodulira yomwe ikufunika, komanso njira yowuma.
4, malingana ndi malo a chitsanzo chozungulira, gwiritsani ntchito mutu wodula kuti mudulire mizere yowongoka ya 4 mozungulira chitsanzo chilichonse chozungulira pamagulu othandizira. Kuyang'ana mu mtengo wa bessel, fyulutayo imadulidwa pamalo enaake, ndipo ming'alu imatha kupangidwa pakati pa mfundo. Pomaliza, filimu yofalitsa ming'alu ikuchitika kuti amalize kudula kwa fyuluta. Kuphulika kwa m'mphepete kwa fyuluta yodulidwa ndi njira yodulirayi ndi yaying'ono, yomwe imapangitsa bwino zokolola za fyuluta yodula ndikuwongolera bwino kudula.
Makina odulira laserpakali pano ndi chida chabwino kwambiri chodulira, ndi kuchuluka kwa zofunikira za zida m'mafakitale osiyanasiyana, komanso kukhudzidwa ndi mafakitale osiyanasiyana, kufunikira kukukulirakulira.